Glossary entry

French term or phrase:

dépanalisation

English translation:

depaneling

Added to glossary by Rimas Balsys
Feb 23, 2014 18:00
10 yrs ago
French term

dépanalisation

French to English Tech/Engineering Computers: Hardware
This is a job posting for a general production assistant by an electronic parts assembler. "Le titulaire du poste est responsable d’effectuer diverses tâches requises pour la production des cartes électroniques telles que la coupe, le lavage, la **dépanalisation**, le test et l’assemblage des produits." And in the next section:
"1. Lavage[...]
2. Coupe et **dépanalisation**
-- Couper les surplus de broches selon les instructions
-- Effectuer la **dépanalisation** manuelle et mécanique pour les produits simples"
I've tried every variation of the word but can't find anything anywhere to make sense of it.
Can anyone help?
Thank you! :-)
Proposed translations (English)
5 depaneling

Discussion

Rimas Balsys (asker) Feb 23, 2014:
@Tony That was indeed my first thought, and it makes sense in terms of the sequence described, but for safety I wanted to check in case it was some obscure production argot...
Tony M Feb 23, 2014:
Typo Surely it is meant to be 'depanelisation'?

Smaller PCBs are often fabricated all together on one large panel, to make more efficient use of the production resources, and then this large panel is broken down into the smaller individual boards for final use. This is often done in a 'breakaway' fashion, a clue to which is the broken perforations that can often be seen as a section of 'rough edge' on some PCBs within domestic electronic equipment etc.

Proposed translations

5 hrs
Selected

depaneling

In this case we are talking about the assembly of electronics boards.
As already pointed out, bare PCBs are manufactured with several individual figures arranged in a bigger panel.
Is common practice not to break out the individual circuits before assembling and soldering of the electronic components, but instead to separate the individual parts only after that the boards are completely finished.
The separation of individual boards so becomes a critical step, because simple manual bend-and-break operations can damage the sensitive electronics parts.
Thus is usually necessary to use systems much more advanced , mechanical or even laser, to depanelize the electronic assemblies.
Something went wrong...
4 KudoZ points awarded for this answer. Comment: "Thanks, bears out my initial thought. And I like your 'About Me' profile :-) "
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